Minister says 85,000-industry ready workforce being trained at 113 institutions
Three major technologies are being developed in India for deployment at Tata Electronics’ Rs.27,000 crore semiconductor plant, which is designed to produce 4.83 crore chips per day.
Electronics & Information Technology Minister Ashwini Vaishnav said this at the ground breaking ceremony of the plant on 3 Aug at Jagiroad in Assam meity .
The state-of-the-art semiconductor Assembly and Test (OSAT) facility is expected to be operational by 2025.
These indigenous advanced semiconductor packaging technologies to be extremely critical for key applications in automotive, communications, and other sectors makeinindia , he said.
The Minister also informed that 85,000 industry-ready workforce at B.Tech, M.Tech and PhD level in semiconductor chip design are being trained at 113 academic institutions across the country. Nine of these institutions are in North-east.
This is a significant step towards creating an end-to-end semiconductor manufacturing ecosystem in India, he highlighted semiconductors .
He also pointed out that this unit will be the site for development of indigenous advanced semiconductor packaging technologies including Wire Bond, flip chip and I-SIP (integrated system in package) technologies and all these three major technologies which will be deployed in this plant are being developed in India tsmc.
“These technologies are extremely critical for key applications such as automotive (especially electric vehicles), communications, network infrastructure and others heavyindustries ,” Vaishnav said.
“Considering that we want to move fast, we are trying to accelerate the building of this factory and we hope sometime in 2025 we will be able to complete part of the facilities and quickly start our operations,” said Tata Sons chairperson N Chandrasekaran. fiinews.com
